Power during manufacturing test can be several times higher than power consumption in functional mode. Excessive power during test can cause IR drop, over-heating, and early aging of the chips. In this dissertation, three different architectures have been introduced to reduce test power in general cases as well as in certain scenarios, including field test.
In the first architecture, scan chains are divided into several segments. Every segment needs a control bit to enable capture in a segment when new faults are detectable on that segment for that pattern. Otherwise, the segment should be disabled to reduce capture power. We group the control bits together into one or more control chains.
To address the extra pin(s) required to shift data into the control chain(s) and significant post processing in the first architecture, we explored a second architecture. The second architecture stitches the control bits into the chains they control as EECBs (embedded enable capture bits) in between the segments. This allows an ATPG software tool to automatically generate the appropriate EECB values for each pattern to maintain the fault coverage. This also works in the presence of an on-chip decompressor.
The last architecture focuses primarily on the self-test of a device in a 3D stacked IC when an existing FPGA in the stack can be programmed as a tester. We show that the energy expended during test is significantly less than would be required using low power patterns fed by an on-chip decompressor for the same very short scan chains.
Computer Science and Engineering
Electrical and Computer Engineering
Creative Commons License
This work is licensed under a Creative Commons Attribution-Noncommercial 4.0 License
Sun, Yi, "Reducing Power During Manufacturing Test Using Different Architectures" (2021). Computer Science and Engineering Theses and Dissertations. 20.